Publications1

PAPERS / PUBLICATIONS:

  • J. P. Young. “Multiple materials enhance front-ends”, Compound Semiconductor Magazine, Volume 21 Issue VIII November/December 2015
  • J. P. Young. “Mobile Phone RF Front End Integration Roadmap” 2015 SEMICON China, March 17, 2015
  • J. Young. “Mobile Phone RF Front End Integration”, 2015 International Conference on Compound Semiconductor Manufacturing Technology, May 19, 2015
  • J. Young, “Mobile Handset PA Performance, ET vs. APT & GaAs HBT vs. SOI/CMOS,” 2014 International RF SOI Workshop, Shanghai, China, Sept. 23, 2014.
  • J. Young, “Carrier Aggregation (CA) Quantifying Front End Loss,” IWPC Workshop, Chicago, Sept. 16, 2014.
  • J. P. Young, “Future RF Front End Hardware Architectures in Handset Applications and the Impact this has on SOI Switch Design” 2014 IEEE-EDS UCR Distinguished Lecture Series
  • J. P. Young, D. Ripley, P. Lehtola, “Envelope Tracking Power Amplifier Optimization for Mobile Applications”, 2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Conf.
  • J. Young, and N. Cheng, “Multimode Multiband Power Amplifier Optimization for Mobile Applications,” IEEE International Symposium on VLSI Design, Automation & Test, 22 April, 2013
  • J. P. Young, “Mobile Handset RF Front End Architectures”, Rose-Hulman Inst. Of Tech., April 17, 2013
  • J. P. Young, “The Future of RF Front End Hardware Architectures in Handset Applications” 2012 IEEE MTTS Buena Ventura Chapter, Camarillo, CA
  • N. Cheng, J. P. Young “Design Considerations and Challenges for Multimode Multiband Handset PA Modules”, 2013 IEEE International Wireless Symposium, China National Convention Center, Beijing
  • N. Cheng, J. P. Young, “Challenges and Requirements of Multimode Multiband Power Amplifiers Development for Mobile Applications”, 2011 IEEE CSICS
  • James P Young, “RF Front End Architectures for Improving Efficiency in Mobile Phone Platforms”, 2011 IEEE MTTS International Microwave Symposium
  • Leo Wilz, Terry Shie, James Young, Timothy Hancock, “A Highly Integrated, Versatile GPS Receiver for E911 Applications”, 2002 IEEE MTTS International Microwave Symposium
  • J. P. Young, “A Highly Integrated Commercial GPS Receiver”, 2000 IEEE MTTS International Microwave Symposium.
  • J. P. Young, M. M. Mulbrook, “Symphony – A Sigma Delta Synthesizer”, 2000 IEEE MTTS International Microwave Symposium.
  • J. P. Young, “RF ASIC Design, Tips to Increasing the Levels of Integration”, workshop on “The One Chip Radio…. Search for The Holy Grail.”. 1999 IEEE MTTS International Microwave Symposium.
  • Co-author of the RF Components section in the 1998 & 2000 “National Electronics Manufacturing Technology Roadmaps”.  (NEMI)
  • J. P. Young, “CMOS’s Part in Low Voltage Low Power RFIC’s”, workshop on “Low Voltage, Low Power Consumption RFIC’s for Wireless Communications Products”, 1997 IEEE MTTS International Microwave Symposium.
  • N.B. Hemesath, J.M.H. Bruckner, R. J. Weber and J.P. Young, “A Miniature GPS Receiver,” Microwave Journal, Sept. 1987, pp. 81-100.
  • Robert J. Weber and James P. Young, “Novel Digital and Microwave GaAs MMIC for GPS Applications”, MILCOM 87, pp. 655-660.     
  • R. Weber, J. Young, W. Edwards, F. Ryan, R Vahrenkamp, R. Erlandson, G. Kaelin, A. Gupta, and C. Kirkpatrick, “A Monolithic Microwave and Digital GaAs Integrated Circuit Chip for L-band Receiver Applications,” 1986 GaAs IC Symposium, pp. 111.

SYMPOSIUM PANELS / WORKSHOPS (Invited):

  • “RF Solutions for GPS-to-handset applications” Instructor “GPS RF ASIC Design” Section, 2002 IEEE MTT-S International Microwave Symposium. (Workshop)
  • “Balancing Technical and Business Concerns” 1999 IEEE MTT-S International Topical Symposium on Technologies for Wireless Applications. (Panel)
  • “Levels of Integration for RFICs?  The One Chip Radio: Realistic Goal or Utter Nonsense?” 1999 IEEE MTT-S International Microwave Symposium. (Panel)
  • “Silicon Vs GaAs for Personal Communication RF ICs” 1993 ISSCC conference (Panel)